Assignee
HESS KEVIN J
US·4 granted patents·13 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0174US8501539B2Semiconductor device packageHESS KEVIN J·Filed 2009·Granted Aug 6, 2013·6 cites·20 claims
- 0270US8105933B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2007·Granted Jan 31, 2012·4 cites·10 claims
- 0365US8318549B2Molded semiconductor package having a filler materialHESS KEVIN J·Filed 2009·Granted Nov 27, 2012·3 cites·19 claims
- 0450US9331050B2Localized alloying for improved bond reliabilityHESS KEVIN J·Filed 2012·Granted May 3, 2016·0 cites·18 claims
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