Individual holder
HIEW SIEW S
US·7 granted patents·3 pending applications·201 citations·filing 2005–2011
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
10 records- 0197US8102657B2Single shot molding method for COB USB/EUSB devices with contact pad ribsHIEW SIEW S·Filed 2008·Granted Jan 24, 2012·60 cites·14 claims
- 0295US8567050B2Single shot molding method for COB USB/EUSB devices with contact pad ribsHIEW SIEW S·Filed 2011·Granted Oct 29, 2013·20 cites·8 claims
- 0395US8141240B2Manufacturing method for micro-SD flash memory cardHIEW SIEW S·Filed 2007·Granted Mar 27, 2012·38 cites·8 claims
- 0494US8102658B2Micro-SD to secure digital adaptor card and manufacturing methodHIEW SIEW S·Filed 2009·Granted Jan 24, 2012·33 cites·22 claims
- 0592US8254134B2Molded memory card with write protection switch assemblyHIEW SIEW S·Filed 2010·Granted Aug 28, 2012·16 cites·21 claims
- 0691US8102662B2USB package with bistable sliding mechanismHIEW SIEW S·Filed 2009·Granted Jan 24, 2012·25 cites·14 claims
- 0780US8240034B1High throughput manufacturing method for micro flash memory cardsHIEW SIEW S·Filed 2008·Granted Aug 14, 2012·9 cites·9 claims
- 0848US2009097215A1Uv-epoxy and ultrasonic case assembly methods for usb flash driveHIEW SIEW S·Filed 2007·Application pending·0 cites
- 0945US2009086448A1Solid state drive with coverless casingHIEW SIEW S·Filed 2007·Application pending·0 cites
- 1041US2007120213A1Wire under dam package and method for packaging image-sensorHIEW SIEW S·Filed 2005·Application pending·0 cites
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