Assignee
HIGUCHI TAKAYUKI
JP·4 granted patents·1 pending application·5 citations·filing 2008–2011
Top patents by PatentIndex Score
5 records- 0163US8663383B2Expansive material and its preparation processHIGUCHI TAKAYUKI·Filed 2010·Granted Mar 4, 2014·1 cites·9 claims
- 0262US8540903B2Electrically conductive paste, and electrical and electronic device comprising the sameHIGUCHI TAKAYUKI·Filed 2008·Granted Sep 24, 2013·3 cites·6 claims
- 0359US8663384B2Cement admixture and cement compositionHIGUCHI TAKAYUKI·Filed 2011·Granted Mar 4, 2014·1 cites·5 claims
- 0450US8436253B2Method of manufacturing mounting structure and mounting structureHIGUCHI TAKAYUKI·Filed 2009·Granted May 7, 2013·0 cites·7 claims
- 0536US2013062107A1Multilayer wiring board and production method of the sameHIGUCHI TAKAYUKI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →