Assignee

HIRAI SHOGO

JP·1 granted patent·1 pending application·8 citations·filing 2011–2011

Technology mixH05K2 Y10T2 H01B1

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2 records

0181US8563872B2Wiring board, wiring board manufacturing method, and via pasteHIRAI SHOGO·Filed 2011·Granted Oct 22, 2013·8 cites·17 claims
0239US2013068513A1Wiring board, production method of the same, and via pasteHIRAI SHOGO·Filed 2011·Application pending·0 cites

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