Assignee
HITACHI YONEZAWA ELECTRONICS
JP·3 granted patents·27 citations·filing 2003–2005
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0191US7015069B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI YONEZAWA ELECTRONICS·Filed 2005·Granted Mar 21, 2006·22 cites·6 claims
- 0248US6943064B2Method of manufacturing a semiconductor package with elevated tubHITACHI YONEZAWA ELECTRONICS·Filed 2004·Granted Sep 13, 2005·3 cites·7 claims
- 0346US6897097B2Semiconductor device and a method of manufacturing the sameHITACHI YONEZAWA ELECTRONICS·Filed 2003·Granted May 24, 2005·2 cites·10 claims
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