Assignee
HO CHENG-EN
TW3 patents
Top patents by PatentIndex Score
US8092621B2Jan 10, 2012
Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
HO CHENG-EN5 citations58
US8702878B2Apr 22, 2014
Method for controlling beta-tin orientation in solder joints
HO CHENG-EN0 citations40
US8207469B2Jun 26, 2012
Method for inhibiting electromigration-induced phase segregation in solder joints
HO CHENG-EN0 citations33