Individual holder
HOANG DINHPHUOC V
US·4 granted patents·1 pending application·227 citations·filing 2006–2011
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
5 records- 0198US8399972B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2006·Granted Mar 19, 2013·86 cites·18 claims
- 0298US8071431B2Overmolded semiconductor package with a wirebond cage for EMI shieldingHOANG DINHPHUOC V·Filed 2010·Granted Dec 6, 2011·119 cites·26 claims
- 0394US9041168B2Overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted May 26, 2015·15 cites·20 claims
- 0489US9054115B2Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shieldingHOANG DINHPHUOC V·Filed 2011·Granted Jun 9, 2015·7 cites·23 claims
- 0536US2012019335A1Self compensated directional couplerHOANG DINHPHUOC V·Filed 2010·Application pending·0 cites
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