Assignee
HOHLFELD OLAF
DE3 patents
Top patents by PatentIndex Score
US8587116B2Nov 19, 2013
Semiconductor module comprising an insert
HOHLFELD OLAF8 citations82
US8134837B2Mar 13, 2012
Twist-secured assembly of a power semiconductor module mountable on a heat sink
HOHLFELD OLAF7 citations82
US8298867B2Oct 30, 2012
Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond
HOHLFELD OLAF1 citations45