Assignee
HONDA KAZUTAKA
JP·3 granted patents·7 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0175US8324968B2Amplifier circuit, signal processor circuit, and semiconductor integrated circuit deviceHONDA KAZUTAKA·Filed 2011·Granted Dec 4, 2012·6 cites·11 claims
- 0261US9024455B2Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted May 5, 2015·1 cites·7 claims
- 0347US8674502B2Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor deviceHONDA KAZUTAKA·Filed 2010·Granted Mar 18, 2014·0 cites·15 claims
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