Assignee
HONG YONG WOO
KR·2 granted patents·2 pending applications·7 citations·filing 2007–2010
Top patents by PatentIndex Score
4 records- 0167US8211540B2Adhesive film composition, associated dicing die bonding film, die package, and associated methodsHONG YONG WOO·Filed 2008·Granted Jul 3, 2012·6 cites·23 claims
- 0262US8394493B2Bonding film composition for semiconductor assembly, bonding film therefrom, and dicing die bond film comprising the sameHONG YONG WOO·Filed 2007·Granted Mar 12, 2013·1 cites·10 claims
- 0340US2009162650A1Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methodsHONG YONG WOO·Filed 2008·Application pending·0 cites
- 0432US2011151207A1Die adhesive film, reel for die adhesive film, mounting apparatus and electronic device comprising the sameHONG YONG WOO·Filed 2010·Application pending·0 cites
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