Assignee
HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD
CN·61 granted patents·26 pending applications·46 citations·filing 2013–2024
Top patents by PatentIndex Score
87 records- 0192US9980386B1Flexible printed circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2017·Granted May 22, 2018·9 cites·11 claims
- 0290US10681824B1Waterproof circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 9, 2020·8 cites·19 claims
- 0389US9807877B1Method for making a multilayer flexible printed circuit boardHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2016·Granted Oct 31, 2017·6 cites·8 claims
- 0487US12382579B2Stretchable circuit board assembly and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Granted Aug 5, 2025·2 cites·20 claims
- 0585US10349533B1Multilayer circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Jul 9, 2019·4 cites·15 claims
- 0682US10349518B1Circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Jul 9, 2019·3 cites·16 claims
- 0780US10561017B1Circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Feb 11, 2020·3 cites·13 claims
- 0879US11044813B2All-directions embeded module, method for manufacturing the all-directions embeded module, and all-directions packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Jun 22, 2021·2 cites·7 claims
- 0978US11140769B1Flexible circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Oct 5, 2021·1 cites·4 claims
- 1078US10772217B1Circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Sep 8, 2020·2 cites·20 claims
- 1175US11234331B2Multilayer printed circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Jan 25, 2022·1 cites·4 claims
- 1274US11871526B2Circuit board and method of manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·7 claims
- 1374US10757817B2Printed circuit board with embedded components for electronic device and method for making the sameHONGQISHENG PREC ELECTRONICS (QINHUANGDAO) CO LTD·Filed 2019·Granted Aug 25, 2020·1 cites·6 claims
- 1473US2024196541A1Transparent circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 1570US11700698B2Method for manufacturing a circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Jul 11, 2023·0 cites·7 claims
- 1670US11291126B2Circuit board and method of manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·6 claims
- 1769US11672083B2Method of manufacturing composite circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·10 claims
- 1868US11483931B2All-directions embeded module, method for manufacturing the all-directions embeded module, and all-directions packaging structureHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Oct 25, 2022·0 cites·11 claims
- 1968US11294285B2Method for manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Apr 5, 2022·0 cites·9 claims
- 2067US12538415B2Flexible circuit board and method for fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·15 claims
- 2167US11582859B2Method for manufacturing flexible circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·10 claims
- 2267US8853000B2Package on package structrue and method for manufacturing sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2013·Granted Oct 7, 2014·2 cites·10 claims
- 2366US12520436B2Circuit board assembly and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·15 claims
- 2466US11399436B2Circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·6 claims
- 2566US11289468B2Package structure and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Mar 29, 2022·1 cites·17 claims
- 2666US11191168B2Method of manufacturing composite circuit board and composite circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·7 claims
- 2765US11304312B2Method for manufacturing a circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2020·Granted Apr 12, 2022·0 cites·7 claims
- 2864US12439520B2Circuit board with embedded resistors and method for fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·15 claims
- 2963US12191056B2Buried thermistor and method of fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·15 claims
- 3062US9000573B2Package on package structure and method for manufacturing sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2014·Granted Apr 7, 2015·1 cites·9 claims
- 3161US2025374421A1Flexible circuit board and method for manufacturing sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 3260US12513821B2Flexible circuit board and method of fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·10 claims
- 3360US11140785B2Flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 3460US2025142717A1Circuit board, method for manufacturing the same and terminal device having the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 3560US2025338400A1Transducer circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 3659US11985764B2Circuit board and method for manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2022·Granted May 14, 2024·0 cites·19 claims
- 3759US10653015B2Multilayer circuit board and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted May 12, 2020·0 cites·7 claims
- 3858US12016119B2Method for manufacturing multilayer printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·9 claims
- 3958US11950371B2Method for manufacturing transparent circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·5 claims
- 4058US10660218B2Method of manufacturing multilayer circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted May 19, 2020·0 cites·10 claims
- 4158US2026068776A1Electronic module and method of manufacturing the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 4257US10827623B2Method of making a circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Nov 3, 2020·0 cites·7 claims
- 4357US10653011B2Method for manufacturing circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2017·Granted May 12, 2020·0 cites·6 claims
- 4457US2026025914A1Circuit board and method of fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 4557US2025140500A1Relay circuit board and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Application pending·0 cites
- 4657US2025167169A1Method of packaging chip, chip packaging structure, and terminal deviceHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 4757US2025365872A1Circuit board and manufacturing method thereofHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2024·Application pending·0 cites
- 4856US10638606B2Composite circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Apr 28, 2020·0 cites·6 claims
- 4956US2025031313A1Flexible circuit board and method of fabricating the sameHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2023·Application pending·0 cites
- 5055US10542627B2Method for manufacturing a flexible printed circuit boardHONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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