Assignee
HORIKAWA YASUYOSHI
JP·3 granted patents·1 pending application·55 citations·filing 2005–2012
Top patents by PatentIndex Score
4 records- 0195US8419442B2Socket and method of fabricating the sameHORIKAWA YASUYOSHI·Filed 2011·Granted Apr 16, 2013·42 cites·11 claims
- 0275US8708711B2Connecting terminal structure, socket and electronic packageHORIKAWA YASUYOSHI·Filed 2012·Granted Apr 29, 2014·9 cites·8 claims
- 0361US8770987B2Connecting terminal structure, manufacturing method of the same and socketHORIKAWA YASUYOSHI·Filed 2011·Granted Jul 8, 2014·4 cites·8 claims
- 0443US2005258509A1Substrate, semiconductor device, and substrate fabricating methodHORIKAWA YASUYOSHI·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HORIKAWA YASUYOSHI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →