Assignee
HOSHINO MASATAKA
JP·3 granted patents·36 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0191US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 0262US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 0344US8148771B2Semiconductor device and method to manufacture thereofHOSHINO MASATAKA·Filed 2010·Granted Apr 3, 2012·0 cites·16 claims
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