Assignee
HOSHINO YUTAKA
JP·4 granted patents·7 citations·filing 2009–2012
Top patents by PatentIndex Score
4 records- 0177US8962418B2Manufacturing method of semiconductor device having semiconductor layers with different thicknessesHOSHINO YUTAKA·Filed 2012·Granted Feb 24, 2015·4 cites·22 claims
- 0274US8482058B2Semiconductor device including a power MISFETHOSHINO YUTAKA·Filed 2012·Granted Jul 9, 2013·2 cites·6 claims
- 0368US8232595B2Semiconductor device including a power MISFET and method of manufacturing the sameHOSHINO YUTAKA·Filed 2011·Granted Jul 31, 2012·1 cites·4 claims
- 0445US8837886B2Optical fiber cable having a sheath and for setting in a conduitHOSHINO YUTAKA·Filed 2009·Granted Sep 16, 2014·0 cites·4 claims
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