Assignee
HOSIER PAUL A
US·5 granted patents·190 citations·filing 2009–2010
Top patents by PatentIndex Score
5 records- 0195US8129258B2Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor waferHOSIER PAUL A·Filed 2009·Granted Mar 6, 2012·182 cites·14 claims
- 0281US8150283B2Method and system for minimizing non-uniformities in output images using halftone correction patchesHOSIER PAUL A·Filed 2010·Granted Apr 3, 2012·5 cites·26 claims
- 0374US8331738B2Reducing buffer size requirements in an electronic registration systemHOSIER PAUL A·Filed 2010·Granted Dec 11, 2012·3 cites·14 claims
- 0446US8208684B2Image data compensation for optical or spatial error in an array of photosensitive chipsHOSIER PAUL A·Filed 2009·Granted Jun 26, 2012·0 cites·19 claims
- 0542US8810616B2Device and method for extending light emitting diode printbar life or improving image qualityHOSIER PAUL A·Filed 2010·Granted Aug 19, 2014·0 cites·19 claims
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