Assignee
HOSOKAWA SEISAKUSHO
JP·3 granted patents·10 citations·filing 1990–1995
Technology mixB29C3
Top patents by PatentIndex Score
3 records- 0134US5545023APressure molding apparatus for molten resinHOSOKAWA SEISAKUSHO·Filed 1995·Granted Aug 13, 1996·5 cites·2 claims
- 0230US5234336APressure molding apparatus for molten resinHOSOKAWA SEISAKUSHO·Filed 1990·Granted Aug 10, 1993·4 cites·2 claims
- 0328US5338182APressure molding apparatus for molten resinHOSOKAWA SEISAKUSHO·Filed 1992·Granted Aug 16, 1994·1 cites·3 claims
Join the waitlist — get patent alerts
Get an alert when HOSOKAWA SEISAKUSHO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →