Assignee
HSIAO CHING-WEN
TW·5 granted patents·18 citations·filing 2009–2012
Top patents by PatentIndex Score
5 records- 0189US9165887B2Semiconductor device with discrete blocksHSIAO CHING-WEN·Filed 2012·Granted Oct 20, 2015·6 cites·17 claims
- 0283US9679836B2Package structures and methods for forming the sameHSIAO CHING-WEN·Filed 2011·Granted Jun 13, 2017·4 cites·19 claims
- 0377US8847387B2Robust joint structure for flip-chip bondingHSIAO CHING-WEN·Filed 2010·Granted Sep 30, 2014·5 cites·15 claims
- 0466US9613917B2Package-on-package (PoP) device with integrated passive device in a viaHSIAO CHING-WEN·Filed 2012·Granted Apr 4, 2017·1 cites·20 claims
- 0561US9607936B2Copper bump joint structures with improved crack resistanceHSIAO CHING-WEN·Filed 2009·Granted Mar 28, 2017·2 cites·11 claims
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