Assignee
HSIAO YI-LI
TW·7 granted patents·3 pending applications·29 citations·filing 2006–2012
Top patents by PatentIndex Score
10 records- 0188US8827695B2Wafer's ambiance controlHSIAO YI-LI·Filed 2009·Granted Sep 9, 2014·14 cites·20 claims
- 0288US8109407B2Apparatus for storing substratesHSIAO YI-LI·Filed 2007·Granted Feb 7, 2012·14 cites·21 claims
- 0378US8276648B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2012·Granted Oct 2, 2012·1 cites·6 claims
- 0455US8101052B2Adjustable anode assembly for a substrate wet processing apparatusHSIAO YI-LI·Filed 2006·Granted Jan 24, 2012·0 cites·18 claims
- 0551US8795486B2PVD target with end of service life detection capabilityHSIAO YI-LI·Filed 2006·Granted Aug 5, 2014·0 cites·20 claims
- 0651US2012061059A1Cooling mechanism for stacked die package and method of manufacturing the sameHSIAO YI-LI·Filed 2011·Application pending·0 cites
- 0747US8668131B2In-situ accuracy control in flux dippingHSIAO YI-LI·Filed 2011·Granted Mar 11, 2014·0 cites·16 claims
- 0843US8702871B2Package assembly cleaning process using vaporized solventHSIAO YI-LI·Filed 2011·Granted Apr 22, 2014·0 cites·17 claims
- 0938US2012227886A1Substrate Assembly Carrier Using Electrostatic ForceHSIAO YI-LI·Filed 2011·Application pending·0 cites
- 1038US2012063090A1Cooling mechanism for stacked die package and method of manufacturing the sameHSIAO YI-LI·Filed 2010·Application pending·0 cites
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