Assignee
HSIEH CHIN-TANG
TW·6 granted patents·6 citations·filing 2011–2012
Top patents by PatentIndex Score
6 records- 0166US8450203B2Bumping process and structure thereofHSIEH CHIN-TANG·Filed 2011·Granted May 28, 2013·2 cites·9 claims
- 0263US8658466B2Semiconductor package structure and method for making the sameHSIEH CHIN-TANG·Filed 2012·Granted Feb 25, 2014·2 cites·13 claims
- 0358US8497571B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jul 30, 2013·2 cites·6 claims
- 0445US8426984B2Substrate structure with compliant bump and manufacturing method thereofHSIEH CHIN-TANG·Filed 2011·Granted Apr 23, 2013·0 cites·8 claims
- 0538US8581384B2Semiconductor package structureHSIEH CHIN-TANG·Filed 2012·Granted Nov 12, 2013·0 cites·6 claims
- 0634US8471372B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
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