Assignee
HSIEH HAO-CHUN
TW·2 granted patents·2 pending applications·3 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0167US8690041B2Method and soldering system of soldering a DIP component on a circuit boardHSIEH HAO-CHUN·Filed 2011·Granted Apr 8, 2014·2 cites·4 claims
- 0255US8462520B2Metal shielding can and assembly of the metal shielding can and a circuit boardHSIEH HAO-CHUN·Filed 2010·Granted Jun 11, 2013·1 cites·6 claims
- 0343US2012090652A1Cleaning apparatus for solder paste in aperturesHSIEH HAO-CHUN·Filed 2011·Application pending·0 cites
- 0438US2012261870A1Printed circuit board, a supporting jig and a positioning methodHSIEH HAO-CHUN·Filed 2012·Application pending·0 cites
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