Assignee
HSIEH TUNG-HSIEN
TW·2 granted patents·3 pending applications·6 citations·filing 2009–2010
Top patents by PatentIndex Score
5 records- 0167US8084853B2Semiconductor flip chip package utilizing wire bonding for net switchingHSIEH TUNG-HSIEN·Filed 2009·Granted Dec 27, 2011·4 cites·23 claims
- 0265US8288870B2Semiconductor chip package and method for designing the sameHSIEH TUNG-HSIEN·Filed 2010·Granted Oct 16, 2012·2 cites·18 claims
- 0344US2010213588A1Wire bond chip packageHSIEH TUNG-HSIEN·Filed 2009·Application pending·0 cites
- 0435US2011042794A1Qfn semiconductor package and circuit board structure adapted for the sameHSIEH TUNG-HSIEN·Filed 2010·Application pending·0 cites
- 0534US2010213589A1Multi-chip packageHSIEH TUNG-HSIEN·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when HSIEH TUNG-HSIEN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →