Assignee
HSIO TECH LLC
US13 patents
Top patents by PatentIndex Score
US9761520B2Sep 12, 2017
Method of making an electrical connector having electrodeposited terminals
HSIO TECH LLC10 citations84
US9689897B2Jun 27, 2017
Performance enhanced semiconductor socket
HSIO TECH LLC13 citations84
US10667410B2May 26, 2020
Method of making a fusion bonded circuit structure
HSIO TECH LLC2 citations73
US10159154B2Dec 18, 2018
Fusion bonded liquid crystal polymer circuit structure
HSIO TECH LLC3 citations73
US9755335B2Sep 5, 2017
Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
HSIO TECH LLC3 citations73
US9699906B2Jul 4, 2017
Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
HSIO TECH LLC3 citations73
US9660368B2May 23, 2017
High performance surface mount electrical interconnect
HSIO TECH LLC3 citations73
US9559447B2Jan 31, 2017
Mechanical contact retention within an electrical connector
HSIO TECH LLC3 citations73
US9536815B2Jan 3, 2017
Semiconductor socket with direct selective metalization
HSIO TECH LLC2 citations73
US10609819B2Mar 31, 2020
Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
HSIO TECH LLC0 citations52
US10453789B2Oct 22, 2019
Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrate
HSIO TECH LLC0 citations52
US10506722B2Dec 10, 2019
Fusion bonded liquid crystal polymer electrical circuit structure
HSIO TECH LLC0 citations41
US9930775B2Mar 27, 2018
Copper pillar full metal via electrical circuit structure
HSIO TECH LLC0 citations34