Assignee
HSU CHI-HSING
TW·7 granted patents·11 pending applications·17 citations·filing 2005–2016
Top patents by PatentIndex Score
18 records- 0185US8519428B2Vertical stacked light emitting structureHSU CHI-HSING·Filed 2011·Granted Aug 27, 2013·9 cites·11 claims
- 0275US8093509B2Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI functionHSU CHI-HSING·Filed 2009·Granted Jan 10, 2012·4 cites·20 claims
- 0372US9786709B1Portable electronic device and image capturing module thereofHSU CHI-HSING·Filed 2016·Granted Oct 10, 2017·2 cites·10 claims
- 0463US8274594B2Image-capturing module for simplifying optical componentHSU CHI-HSING·Filed 2010·Granted Sep 25, 2012·2 cites·11 claims
- 0550US2006081396A1Circuit substrate and method of manufacturing plated through slot thereonHSU CHI-HSING·Filed 2005·Application pending·0 cites
- 0649US2005252683A1Circuit substrate and method of manufacturing plated through slot thereonHSU CHI-HSING·Filed 2005·Application pending·0 cites
- 0748US8593560B2Image-capturing module for simplifying optical componentHSU CHI-HSING·Filed 2010·Granted Nov 26, 2013·0 cites·14 claims
- 0848US2011058091A1Image-capturing module with a flexible type substrate structureHSU CHI-HSING·Filed 2010·Application pending·0 cites
- 0948US2011058088A1Image-capturing module with a flexible type substrate structureHSU CHI-HSING·Filed 2010·Application pending·0 cites
- 1046US2007013079A1Die pad arrangement and bumpless chip package applying the sameHSU CHI-HSING·Filed 2005·Application pending·0 cites
- 1143US2010321199A1Light-emitting module and image-capturing module for arbitrarily changing light-emitting positionHSU CHI-HSING·Filed 2009·Application pending·0 cites
- 1242US9860431B1Portable electronic device and image capturing module thereofHSU CHI-HSING·Filed 2016·Granted Jan 2, 2018·0 cites·10 claims
- 1341US2013307105A1Image-sensing module for reducing its whole thicknessHSU CHI-HSING·Filed 2012·Application pending·0 cites
- 1440US8476651B2Vertical stacked light emitting structureHSU CHI-HSING·Filed 2011·Granted Jul 2, 2013·0 cites·2 claims
- 1540US2006158863A1Interconnection structure through passive componentHSU CHI-HSING·Filed 2005·Application pending·0 cites
- 1640US2013234272A1Image-sensing moduleHSU CHI-HSING·Filed 2012·Application pending·0 cites
- 1737US2011058090A1Image-capturing module for electrically connecting two circuit substrates with each otherHSU CHI-HSING·Filed 2010·Application pending·0 cites
- 1836US2011057130A1Flip-chip type image-capturing moduleHSU CHI-HSING·Filed 2010·Application pending·0 cites
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