Assignee

HSU CHUN-LEI

TW·2 granted patents·55 citations·filing 2010–2012

Technology mixH01L2 H10W2

Top patents by PatentIndex Score

2 records

0195US8981559B2Package on package devices and methods of packaging semiconductor diesHSU CHUN-LEI·Filed 2012·Granted Mar 17, 2015·50 cites·20 claims
0279US8993431B2Method of fabricating bump structureHSU CHUN-LEI·Filed 2010·Granted Mar 31, 2015·5 cites·20 claims

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