Assignee
HSU HSIN-HUI
TW4 patents
Top patents by PatentIndex Score
US8829628B2Sep 9, 2014
MEMS package structure
HSU HSIN-HUI2 citations61
US8729660B2May 20, 2014
MEMS integrated chip with cross-area interconnection
HSU HSIN-HUI0 citations51
US8704331B2Apr 22, 2014
MEMS integrated chip with cross-area interconnection
HSU HSIN-HUI0 citations51
US8247253B2Aug 21, 2012
MEMS package structure and method for fabricating the same
HSU HSIN-HUI0 citations51