Assignee
HSU HUNG-HSIN
TW·3 granted patents·2 pending applications·28 citations·filing 2008–2010
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0187US8115319B2Flip chip package maintaining alignment during solderingHSU HUNG-HSIN·Filed 2010·Granted Feb 14, 2012·15 cites·9 claims
- 0285US8237273B2Metal post chip connecting device and method free to use soldering materialHSU HUNG-HSIN·Filed 2010·Granted Aug 7, 2012·11 cites·10 claims
- 0355US8212349B2Semiconductor package having chip using copper processHSU HUNG-HSIN·Filed 2009·Granted Jul 3, 2012·2 cites·10 claims
- 0440US2010155937A1Wafer structure with conductive bumps and fabrication method thereofHSU HUNG-HSIN·Filed 2008·Application pending·0 cites
- 0540US2011133327A1Semiconductor package of metal post solder-chip connectionHSU HUNG-HSIN·Filed 2009·Application pending·0 cites
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