Assignee
HSU SHIH-HSUN
TW·2 granted patents·1 pending application·13 citations·filing 2006–2007
Top patents by PatentIndex Score
3 records- 0174US8227917B2Bond pad design for fine pitch wire bondingHSU SHIH-HSUN·Filed 2007·Granted Jul 24, 2012·7 cites·11 claims
- 0269US8072076B2Bond pad structures and integrated circuit chip having the sameHSU SHIH-HSUN·Filed 2006·Granted Dec 6, 2011·6 cites·10 claims
- 0342US2008277659A1Test structure for semiconductor chipHSU SHIH-HSUN·Filed 2007·Application pending·0 cites
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