Assignee
HSU SHIN-PING
TW·3 granted patents·5 citations·filing 2009–2009
Top patents by PatentIndex Score
3 records- 0159US8188379B2Package substrate structureHSU SHIN-PING·Filed 2009·Granted May 29, 2012·3 cites·18 claims
- 0253US8421213B2Package structureHSU SHIN-PING·Filed 2009·Granted Apr 16, 2013·2 cites·19 claims
- 0343US8129829B2Package substrate having embedded photosensitive semiconductor chip and fabrication method thereofHSU SHIN-PING·Filed 2009·Granted Mar 6, 2012·0 cites·14 claims
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