Assignee
HU CHU-CHIN
TW·2 granted patents·1 pending application·4 citations·filing 2006–2011
Top patents by PatentIndex Score
3 records- 0175US8531021B2Package stack device and fabrication method thereofHU CHU-CHIN·Filed 2011·Granted Sep 10, 2013·4 cites·8 claims
- 0238US2006284288A1Wafer and single chip having circuit rearranged structure and method for fabricating the sameHU CHU-CHIN·Filed 2006·Application pending·0 cites
- 0335US8222080B2Fabrication method of package structureHU CHU-CHIN·Filed 2010·Granted Jul 17, 2012·0 cites·11 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →