Assignee
HU DYI CHUNG
TW·80 granted patents·17 pending applications·234 citations·filing 2007–2025
Top patents by PatentIndex Score
97 records- 0198US9543249B1Package substrate with lateral communication circuitryHU DYI-CHUNG·Filed 2015·Granted Jan 10, 2017·42 cites·20 claims
- 0296US9263373B2Thin film RDL for nanochip packageHU DYI-CHUNG·Filed 2015·Granted Feb 16, 2016·19 cites·10 claims
- 0395US10037946B2Package structure having embedded bonding film and manufacturing method thereofHU DYI CHUNG·Filed 2017·Granted Jul 31, 2018·10 cites·14 claims
- 0494US11948899B2Semiconductor substrate structure and manufacturing method thereofHU DYI CHUNG·Filed 2022·Granted Apr 2, 2024·2 cites·10 claims
- 0594US10643936B2Package substrate and package structureHU DYI CHUNG·Filed 2017·Granted May 5, 2020·11 cites·18 claims
- 0694US10002852B1Package on package configurationHU DYI CHUNG·Filed 2016·Granted Jun 19, 2018·11 cites·12 claims
- 0794US9673148B2System in packageHU DYI-CHUNG·Filed 2015·Granted Jun 6, 2017·10 cites·13 claims
- 0892US9385056B2Packaging substrate having embedded interposer and fabrication method thereofHU DYI-CHUNG·Filed 2012·Granted Jul 5, 2016·15 cites·2 claims
- 0990US11125781B1Integrated substrate and manufacturing method thereofHU DYI CHUNG·Filed 2020·Granted Sep 21, 2021·2 cites·6 claims
- 1090US10290586B2Package substrate with embedded noise shielding wallsHU DYI CHUNG·Filed 2017·Granted May 14, 2019·7 cites·9 claims
- 1189US9431335B2Molding compound supported RDL for IC packageHU DYI-CHUNG·Filed 2014·Granted Aug 30, 2016·10 cites·19 claims
- 1288US12176277B2Package substrate and package structureHU DYI CHUNG·Filed 2022·Granted Dec 24, 2024·1 cites·18 claims
- 1387US8946564B2Packaging substrate having embedded through-via interposer and method of fabricating the sameHU DYI-CHUNG·Filed 2012·Granted Feb 3, 2015·7 cites·6 claims
- 1486US9799622B2High density film for IC packageHU DYI-CHUNG·Filed 2014·Granted Oct 24, 2017·6 cites·14 claims
- 1585US10535622B2Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layerHU DYI CHUNG·Filed 2018·Granted Jan 14, 2020·4 cites·18 claims
- 1685US9837347B2Coaxial copper pillarHU DYI-CHUNG·Filed 2016·Granted Dec 5, 2017·4 cites·16 claims
- 1785US9756738B2Redistribution film for IC packageHU DYI-CHUNG·Filed 2014·Granted Sep 5, 2017·5 cites·18 claims
- 1884US10224300B2Pad structure and manufacturing method thereofHU DYI CHUNG·Filed 2017·Granted Mar 5, 2019·4 cites·16 claims
- 1984US9958616B2Embedded optical fiber moduleHU DYI CHUNG·Filed 2016·Granted May 1, 2018·4 cites·8 claims
- 2083US9859202B2Spacer connectorHU DYI-CHUNG·Filed 2016·Granted Jan 2, 2018·4 cites·9 claims
- 2183US8304923B2Chip packaging structureHU DYI-CHUNG·Filed 2007·Granted Nov 6, 2012·11 cites·15 claims
- 2282US12315788B1Semiconductor substrate and manufacturing method thereofHU DYI CHUNG·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 2382US8952268B2Interposed substrate and manufacturing method thereofHU DYI-CHUNG·Filed 2012·Granted Feb 10, 2015·5 cites·3 claims
- 2481US11309252B2Package substrate and package structureHU DYI CHUNG·Filed 2020·Granted Apr 19, 2022·1 cites·19 claims
- 2581US9806044B2Bonding film for signal communication between central chip and peripheral chips and fabricating method thereofHU DYI-CHUNG·Filed 2016·Granted Oct 31, 2017·3 cites·13 claims
- 2679US10154599B2Redistribution film for IC packageHU DYI CHUNG·Filed 2017·Granted Dec 11, 2018·2 cites·9 claims
- 2777US12249567B2Manufacturing method of integrated substrate structureHU DYI CHUNG·Filed 2023·Granted Mar 11, 2025·0 cites·8 claims
- 2877US9362256B2Bonding process for a chip bonding to a thin film substrateHU DYI-CHUNG·Filed 2015·Granted Jun 7, 2016·2 cites·13 claims
- 2977US2025070006A1Package substrate and package structureHU DYI CHUNG·Filed 2024·Application pending·0 cites
- 3076US9627285B2Package substrateHU DYI-CHUNG·Filed 2014·Granted Apr 18, 2017·3 cites·19 claims
- 3176US2025029911A1Manufacturing method of semiconductor substrateHU DYI CHUNG·Filed 2024·Application pending·0 cites
- 3275US12148688B2Semiconductor substrate and manufacturing method thereofHU DYI CHUNG·Filed 2024·Granted Nov 19, 2024·0 cites·27 claims
- 3375US10818584B2Package substrate and package structureHU DYI CHUNG·Filed 2017·Granted Oct 27, 2020·2 cites·13 claims
- 3475US9737215B2Reflective sensing module having light chip and sensor chip mounted to bottom surface of transparent top cover, and wristband comprising said reflective sensing moduleHU DYI-CHUNG·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 3574US9685429B2Stacked package-on-package memory devicesHU DYI-CHUNG·Filed 2015·Granted Jun 20, 2017·2 cites·20 claims
- 3674US9502322B2Molding compound supported RDL for IC packageHU DYI-CHUNG·Filed 2014·Granted Nov 22, 2016·3 cites·23 claims
- 3774US9295163B2Method of making a circuit board structure with embedded fine-pitch wiresHU DYI-CHUNG·Filed 2013·Granted Mar 22, 2016·2 cites·20 claims
- 3874US2024222277A1Method for manufacturing integrated substrate structureHU DYI CHUNG·Filed 2024·Application pending·0 cites
- 3973US10304794B2Manufacturing method of integrated circuit packageHU DYI CHUNG·Filed 2017·Granted May 28, 2019·1 cites·7 claims
- 4073US10153234B2System in packageHU DYI CHUNG·Filed 2016·Granted Dec 11, 2018·2 cites·20 claims
- 4173US9799616B2Package substrate with double sided fine line RDLHU DYI-CHUNG·Filed 2016·Granted Oct 24, 2017·2 cites·7 claims
- 4272US11876291B2Millimeter-wave antenna module package structure and manufacturing method thereofHU DYI CHUNG·Filed 2022·Granted Jan 16, 2024·0 cites·8 claims
- 4372US9735079B2Molding compound wrapped package substrateHU DYI-CHUNG·Filed 2015·Granted Aug 15, 2017·2 cites·19 claims
- 4472US9502321B2Thin film RDL for IC packageHU DYI-CHUNG·Filed 2015·Granted Nov 22, 2016·2 cites·17 claims
- 4572US2024088552A1Manufacturing method of millimeter-wave antenna module package structureHU DYI CHUNG·Filed 2023·Application pending·0 cites
- 4670US2025336787A1Semiconductor substrateHU DYI CHUNG·Filed 2025·Application pending·0 cites
- 4769US12550758B1Substrate and manufacturing method thereofHU DYI CHUNG·Filed 2024·Granted Feb 10, 2026·0 cites·21 claims
- 4869US10373918B2Package substrateHU DYI CHUNG·Filed 2017·Granted Aug 6, 2019·1 cites·18 claims
- 4969US10109598B2Composite carrier for warpage managementHU DYI CHUNG·Filed 2016·Granted Oct 23, 2018·1 cites·14 claims
- 5069US10032702B2Package structure and manufacturing method thereofHU DYI CHUNG·Filed 2017·Granted Jul 24, 2018·1 cites·11 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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