Assignee
HU HAITIAN
US·2 granted patents·12 citations·filing 2009–2012
Top patents by PatentIndex Score
2 records- 0180US8312404B2Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packagesHU HAITIAN·Filed 2009·Granted Nov 13, 2012·12 cites·22 claims
- 0241US8788994B2Routing of local clock interconnectsHU HAITIAN·Filed 2012·Granted Jul 22, 2014·0 cites·20 claims
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