Assignee
HU HSIEN-PIN
TW·4 granted patents·228 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0198US8105875B1Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2010·Granted Jan 31, 2012·192 cites·13 claims
- 0293US8759150B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Jun 24, 2014·13 cites·13 claims
- 0393US8319349B2Approach for bonding dies onto interposersHU HSIEN-PIN·Filed 2012·Granted Nov 27, 2012·13 cites·16 claims
- 0490US10297550B23D IC architecture with interposer and interconnect structure for bonding diesHU HSIEN PIN·Filed 2010·Granted May 21, 2019·10 cites·20 claims
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