Assignee
HU XUEJIAO
US·2 granted patents·2 pending applications·7 citations·filing 2007–2010
Top patents by PatentIndex Score
4 records- 0177US8084856B2Thermal spacer for stacked die package thermal managementHU XUEJIAO·Filed 2010·Granted Dec 27, 2011·5 cites·18 claims
- 0266US8154728B2Analytical equipment enclosure incorporating phase changing materialsHU XUEJIAO·Filed 2008·Granted Apr 10, 2012·2 cites·21 claims
- 0343US2009004317A1High thermal conductivity molding compound for flip-chip packagesHU XUEJIAO·Filed 2007·Application pending·0 cites
- 0440US2009166844A1Metal cover on flip-chip matrix-array (fcmx) substrate for low cost cpu assemblyHU XUEJIAO·Filed 2007·Application pending·0 cites
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