Assignee
HU YU-SHAN
TW·3 granted patents·1 pending application·88 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0196US8709865B2Fabrication method of packaging substrate having through-holed interposer embedded thereinHU YU-SHAN·Filed 2012·Granted Apr 29, 2014·43 cites·12 claims
- 0296US8269337B2Packaging substrate having through-holed interposer embedded therein and fabrication method thereofHU YU-SHAN·Filed 2011·Granted Sep 18, 2012·43 cites·11 claims
- 0369US8637402B2Conductive line structure and the method of forming the sameHU YU-SHAN·Filed 2011·Granted Jan 28, 2014·2 cites·11 claims
- 0447US2012061830A1Back side protective structure for a semiconductor packageHU YU-SHAN·Filed 2011·Application pending·0 cites
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