Assignee
HUANG CHENG-LIN
TW·3 granted patents·19 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0191US8304906B2Partial air gap formation for providing interconnect isolation in integrated circuitsHUANG CHENG-LIN·Filed 2010·Granted Nov 6, 2012·19 cites·20 claims
- 0249US9024438B2Self-aligning conductive bump structure and method of making the sameHUANG CHENG-LIN·Filed 2011·Granted May 5, 2015·0 cites·20 claims
- 0349US8426307B2Reducing resistivity in interconnect structures of integrated circuitsHUANG CHENG-LIN·Filed 2011·Granted Apr 23, 2013·0 cites·20 claims
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