Assignee
HUANG CHUN-AN
TW·2 granted patents·4 citations·filing 2010–2010
Top patents by PatentIndex Score
2 records- 0174US8610272B2Package structure with micro-electromechanical element and manufacturing method thereofHUANG CHUN-AN·Filed 2010·Granted Dec 17, 2013·4 cites·7 claims
- 0234US8288189B2Package structure having MEMS element and fabrication method thereofHUANG CHUN-AN·Filed 2010·Granted Oct 16, 2012·0 cites·19 claims
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