Assignee
HUANG HON-LIN
TW·2 granted patents·1 pending application·70 citations·filing 2007–2010
Top patents by PatentIndex Score
3 records- 0196US8158489B2Formation of TSV backside interconnects by modifying carrier wafersHUANG HON-LIN·Filed 2010·Granted Apr 17, 2012·47 cites·16 claims
- 0294US8736050B2Front side copper post joint structure for temporary bond in TSV applicationHUANG HON-LIN·Filed 2010·Granted May 27, 2014·23 cites·14 claims
- 0342US2008303154A1Through-silicon via interconnection formed with a cap layerHUANG HON-LIN·Filed 2007·Application pending·0 cites
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