Assignee

HUANG HSIN-TING

TW·2 granted patents·13 citations·filing 2011–2012

Technology mixH10W2 B81B1 B81C1

Top patents by PatentIndex Score

2 records

0190US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
0243US8686571B2Bonding layer structure and method for wafer to wafer bondingHUANG HSIN-TING·Filed 2012·Granted Apr 1, 2014·0 cites·14 claims

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