Assignee
HUANG HUEI-NUAN
TW·1 granted patent·1 pending application·0 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0137US8520391B2Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereofHUANG HUEI-NUAN·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
- 0229US2013256915A1Packaging substrate, semiconductor package and fabrication method thereofHUANG HUEI-NUAN·Filed 2012·Application pending·0 cites
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