Assignee
HUANG SHUN PING
TW·3 granted patents·3 pending applications·10 citations·filing 2015–2023
Top patents by PatentIndex Score
6 records- 0181US11205635B2Low temperature hybrid bonding structures and manufacturing method thereofHUANG SHUN PING·Filed 2020·Granted Dec 21, 2021·2 cites·15 claims
- 0277US10504841B2Semiconductor package and method of forming the sameHUANG SHUN PING·Filed 2018·Granted Dec 10, 2019·4 cites·13 claims
- 0376US9673061B2Method for thermal process in packaging assembly of semiconductorHUANG SHUN-PING·Filed 2015·Granted Jun 6, 2017·4 cites·14 claims
- 0452US2024290681A1Integrated hybrid heat spreader manufacturing method and thereofHUANG SHUN PING·Filed 2023·Application pending·0 cites
- 0549US2024162107A1Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integrationHUANG SHUN PING·Filed 2023·Application pending·0 cites
- 0637US2020051897A1Semiconductor packageHUANG SHUN PING·Filed 2019·Application pending·0 cites
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