Assignee
HUANG WEN-PING
TW·3 granted patents·1 pending application·1 citations·filing 2005–2012
Top patents by PatentIndex Score
4 records- 0152US7446401B2Structure of power semiconductor with twin metal and ceramic platesHUANG WEN-PING·Filed 2005·Granted Nov 4, 2008·1 cites·6 claims
- 0233US2013075891A1Flip chip type full wave rectification semiconductor device and its manufacturing methodHUANG WEN-PING·Filed 2011·Application pending·0 cites
- 0331US8404565B2Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plateHUANG WEN-PING·Filed 2010·Granted Mar 26, 2013·0 cites·12 claims
- 0424US8791551B2Well-through type diode element/component and manufacturing method for themHUANG WEN-PING·Filed 2012·Granted Jul 29, 2014·0 cites·4 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →