Assignee
HUANG YAO-SHENG
TW·1 granted patent·3 pending applications·0 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0134US8969869B2Integrated circuit wafer and integrated circuit dieHUANG YAO-SHENG·Filed 2010·Granted Mar 3, 2015·0 cites·14 claims
- 0230US2011103034A1Electronic chip and substrate providing insulation protection between conducting nodesHUANG YAO-SHENG·Filed 2010·Application pending·0 cites
- 0329US2011272799A1Ic chip and ic chip manufacturing method thereofHUANG YAO-SHENG·Filed 2011·Application pending·0 cites
- 0429US2011256690A1Integrated circuit wafer dicing methodHUANG YAO-SHENG·Filed 2011·Application pending·0 cites
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