Assignee
HWANG SON-KWAN
KR·2 granted patents·5 citations·filing 2009–2010
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0168US8183673B2Through-silicon via structures providing reduced solder spreading and methods of fabricating the sameHWANG SON-KWAN·Filed 2009·Granted May 22, 2012·5 cites·30 claims
- 0239US8119448B2Semiconductor chip, wafer stack package using the same, and methods of manufacturing the sameHWANG SON-KWAN·Filed 2010·Granted Feb 21, 2012·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when HWANG SON-KWAN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →