Assignee
HYMITE AS
DK26 patents
Top patents by PatentIndex Score
US6818464B2Nov 16, 2004
Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
HYMITE AS154 citations98
US6856717B2Feb 15, 2005
Package with a light emitting device
HYMITE AS70 citations97
US7528422B2May 5, 2009
Package for a light emitting element with integrated electrostatic discharge protection
HYMITE AS46 citations93
US7662710B2Feb 16, 2010
Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
HYMITE AS26 citations92
US7531445B2May 12, 2009
Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
HYMITE AS35 citations92
US7057274B2Jun 6, 2006
Semiconductor structures having through-holes sealed with feed-through metalization
HYMITE AS34 citations92
US6969204B2Nov 29, 2005
Optical package with an integrated lens and optical assemblies incorporating the package
HYMITE AS49 citations92
US6786654B2Sep 7, 2004
Encapsulated optical fiber end-coupled device
HYMITE AS42 citations92
US7419853B2Sep 2, 2008
Method of fabrication for chip scale package for a micro component
HYMITE AS37 citations91
US7467897B2Dec 23, 2008
Light transmitting modules with optical power monitoring
HYMITE AS25 citations89
US7165896B2Jan 23, 2007
Light transmitting modules with optical power monitoring
HYMITE AS23 citations89
US7732829B2Jun 8, 2010
Optoelectronic device submount
HYMITE AS10 citations84
US7553695B2Jun 30, 2009
Method of fabricating a package for a micro component
HYMITE AS8 citations82
US7253388B2Aug 7, 2007
Assembly with self-alignment features to position a cover on a substrate that supports a micro component
HYMITE AS16 citations82
US6832013B1Dec 14, 2004
Hybrid integration of active and passive optical components on an Si-board
HYMITE AS25 citations82
US7213978B2May 8, 2007
Optical device receiving substrate and optical device holding carrier
HYMITE AS15 citations80
US7109580B2Sep 19, 2006
Hermetically sealed package for optical, electronic, opto-electronic and other devices
HYMITE AS14 citations80
US7543999B2Jun 9, 2009
Optical module hermetically packaged in micro-machined structures
HYMITE AS12 citations77
US7681306B2Mar 23, 2010
Method of forming an assembly to house one or more micro components
HYMITE AS7 citations73
US7081412B2Jul 25, 2006
Double-sided etching technique for semiconductor structure with through-holes
HYMITE AS5 citations73
US7470622B2Dec 30, 2008
Fabrication and use of polished silicon micro-mirrors
HYMITE AS2 citations62
US7415180B2Aug 19, 2008
Accurate positioning of components of an optical assembly
HYMITE AS5 citations59
US7209235B2Apr 24, 2007
Accurate positioning of components of a optical assembly
HYMITE AS5 citations59
US7388285B2Jun 17, 2008
Hermetically sealed package for optical, electronic, opto-electronic and other devices
HYMITE AS3 citations58
US7732234B2Jun 8, 2010
Fabrication process for package with light emitting device on a sub-mount
HYMITE AS3 citations56
US7732240B2Jun 8, 2010
Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
HYMITE AS0 citations51