Assignee
HYUNDAI MICROELECTRONICS CO LT
KR·11 granted patents·88 citations·filing 1997–2002
Top patents by PatentIndex Score
11 records- 0167US6372116B1Method of forming a conductive layer and an electroplating apparatus thereofHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Apr 16, 2002·17 cites·2 claims
- 0266US6797135B2Electroplating apparatusHYUNDAI MICROELECTRONICS CO LT·Filed 2002·Granted Sep 28, 2004·4 cites·20 claims
- 0345US6753564B2Capacitor of semiconductor device and method of fabricating the sameHYUNDAI MICROELECTRONICS CO LT·Filed 2002·Granted Jun 22, 2004·2 cites·9 claims
- 0443US6104656ASense amplifier control circuit in semiconductor memoryHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Aug 15, 2000·9 cites·14 claims
- 0542US6192160B1Hardware architectures for image dilation and erosion operationsHYUNDAI MICROELECTRONICS CO LT·Filed 1997·Granted Feb 20, 2001·18 cites·7 claims
- 0641US6358794B1Capacitor of semiconductor device and method of fabricating the sameHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Mar 19, 2002·10 cites·19 claims
- 0737US6664614B2Lead frame and bottom lead semiconductor package using the lead frameHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Dec 16, 2003·7 cites·5 claims
- 0834US6340636B1Method for forming metal line in semiconductor deviceHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Jan 22, 2002·4 cites·9 claims
- 0932US6511890B2Method of fabricating a semiconductor deviceHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Jan 28, 2003·2 cites·14 claims
- 1031US6583054B2Method for forming conductive line in semiconductor deviceHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Jun 24, 2003·8 cites·11 claims
- 1123US6146932AMethod for fabricating metal-oxide-semiconductor field effect transistor deviceHYUNDAI MICROELECTRONICS CO LT·Filed 1999·Granted Nov 14, 2000·7 cites·15 claims
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