Assignee
Huang meiquan
CN·3 granted patents·1 pending application·4 citations·filing 2010–2013
Top patents by PatentIndex Score
4 records- 0167US8288847B2Dual die semiconductor packageHuang meiquan·Filed 2010·Granted Oct 16, 2012·4 cites·11 claims
- 0242US8878348B2Semiconductor device and method of assembling sameHuang meiquan·Filed 2013·Granted Nov 4, 2014·0 cites·20 claims
- 0335US8524529B2Brace for wire bondHuang meiquan·Filed 2011·Granted Sep 3, 2013·0 cites·13 claims
- 0434US2012326288A1Method of assembling semiconductor deviceHuang meiquan·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →