Assignee
ICHIKAWA HIROYUKI
JP·3 granted patents·1 pending application·5 citations·filing 2003–2010
Top patents by PatentIndex Score
4 records- 0167US8424854B2Fluid-filled type vibration damping deviceICHIKAWA HIROYUKI·Filed 2009·Granted Apr 23, 2013·5 cites·9 claims
- 0245US8212261B2SiC semiconductor device with BPSG insulation filmICHIKAWA HIROYUKI·Filed 2008·Granted Jul 3, 2012·0 cites·14 claims
- 0336US8573570B2Fluid-filled vibration damping deviceICHIKAWA HIROYUKI·Filed 2010·Granted Nov 5, 2013·0 cites·4 claims
- 0433US2006249328A1Muffler for motor vehicleICHIKAWA HIROYUKI·Filed 2003·Application pending·0 cites
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