Assignee
IHARA TERUKAZU
JP·4 granted patents·11 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0181US9226395B2Printed circuit board and method of manufacturing the sameIHARA TERUKAZU·Filed 2012·Granted Dec 29, 2015·6 cites·10 claims
- 0271US8477507B2Suspension board assembly sheet with circuits and method for manufacturing the sameIHARA TERUKAZU·Filed 2010·Granted Jul 2, 2013·2 cites·11 claims
- 0367US8310668B2Producing method of wired circuit boardIHARA TERUKAZU·Filed 2010·Granted Nov 13, 2012·2 cites·3 claims
- 0458US9313880B2Printed circuit board, printed circuit board assembly sheet and method of manufacturing the sameIHARA TERUKAZU·Filed 2011·Granted Apr 12, 2016·1 cites·6 claims
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