Assignee
II-VI OPTOELECTRONIC DEVICES INC
US·6 granted patents·1 pending application·37 citations·filing 2015–2017
Top patents by PatentIndex Score
7 records- 0191US10600718B1Heat sink packageII VI OPTOELECTRONIC DEVICES INC·Filed 2015·Granted Mar 24, 2020·9 cites·13 claims
- 0289US9705284B1VCSEL with at least one through substrate viaII-VI OPTOELECTRONIC DEVICES INC·Filed 2015·Granted Jul 11, 2017·15 cites·19 claims
- 0377US10818611B2Stress relief in semiconductor wafersII VI OPTOELECTRONIC DEVICES INC·Filed 2017·Granted Oct 27, 2020·3 cites·20 claims
- 0477US10439360B1VCSEL with emission on substrate sideII VI OPTOELECTRONIC DEVICES INC·Filed 2015·Granted Oct 8, 2019·3 cites·21 claims
- 0575US11271367B1Method to form a self-aligned evaporated metal contact in a deep hole and VCSEL with such contactII VI OPTOELECTRONIC DEVICES INC·Filed 2015·Granted Mar 8, 2022·4 cites·11 claims
- 0673US10347591B2Metallic, tunable thin film stress compensation for epitaxial wafersII VI OPTOELECTRONIC DEVICES INC·Filed 2017·Granted Jul 9, 2019·3 cites·29 claims
- 0731US2017148747A1Stress relief in semiconductor wafersII-VI OPTOELECTRONIC DEVICES INC·Filed 2016·Application pending·0 cites
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