Assignee
IIDA KENJI
JP·3 granted patents·3 pending applications·12 citations·filing 2008–2012
Top patents by PatentIndex Score
6 records- 0177US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 0266US9380649B2Jacket heater and method for attaching sameIIDA KENJI·Filed 2011·Granted Jun 28, 2016·2 cites·16 claims
- 0363US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 0436US2012126393A1Resin composition, multilayer body containing the same, semiconductor device, and filmIIDA KENJI·Filed 2010·Application pending·0 cites
- 0534US2013288120A1Polyimide resin composition and laminate including polyimide resin compositionIIDA KENJI·Filed 2012·Application pending·0 cites
- 0631US2012295085A1Polymide resin composition, adhesive agent and laminate each comprising same, and deviceIIDA KENJI·Filed 2011·Application pending·0 cites
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